RAONTECH Extends MicroLED Technology to AI Data Centres
RAONTECH is expanding its silicon backplane and multichannel driving technologies for micro light-emitting diodes (MicroLEDs) into optical communications for artificial intelligence (AI) data centres.
The company said on 3 September that chief executive Kim Bo-eun attended the 2026 MicroLED Technology Forum in Taipei, Taiwan, on 1 September. He presented RAONTECH’s technology and business plans for MicroLEDs and next-generation optical interconnects during the forum.
The presentation covered MicroLED components and the challenges involved in mass production for all-day wearable AI and augmented reality (AR) glasses. It was presented under the theme of microdisplays for all-day wearable AI and AR glasses.
The presentation also addressed power consumption and heat generation in MicroLED displays. MicroLED technology provides high power efficiency for monochrome green displays and indoor environments. However, power consumption and heat generation increase when higher brightness is required for full-colour displays and outdoor use.
RAONTECH proposed improvements based on its low-power backplane technology to meet these requirements. The technology is used to control MicroLED pixels and is being considered for applications beyond display systems.
Optical interconnects for AI data centres were also a focus of the forum, alongside co-packaged optics (CPO) and optical coupling technologies. These technologies require semiconductor solutions capable of managing multiple optical sources and their individual channels.
RAONTECH plans to apply its low-power backplane design technology to controlling MicroLED pixels, driving multichannel optical sources, and enabling optical interconnects for AI data centres. The planned application extends the use of the company’s display-related semiconductor technology into optical communications.
CPO and optical interconnect applications require semiconductor technologies that can simultaneously drive multiple optical sources while independently controlling each channel. This requirement is consistent with the multichannel driving capabilities RAONTECH has developed for its display technologies.
The company is therefore expanding its silicon backplane and multichannel driving technologies from MicroLED displays into optical communications. RAONTECH developed technology for display applications that uses the backplane to control MicroLED pixels.
RAONTECH has also gained experience supplying products related to optical communications. The company did not disclose the specific products it has supplied or identify the customers involved.
Its work in optical communications is being presented alongside its development of MicroLED technology. The company’s activities discussed at the Taipei forum covered both the technical challenges associated with MicroLED displays and the application of related semiconductor technologies to optical interconnects.
For MicroLED applications, the company is addressing the power requirements associated with higher brightness levels. Full-colour displays and outdoor applications can require greater brightness than monochrome green displays and indoor environments, resulting in increased power usage and heat production.
For optical communications, RAONTECH is applying its low-power backplane design and multichannel driving technologies to optical source control. The planned applications include driving multichannel optical sources and optical interconnects for AI data centres.
The company’s existing experience in supplying optical communications products is also part of its activities in this area. RAONTECH is combining that experience with its MicroLED silicon backplane technology to develop applications for next-gen optical interconnects.
RAONTECH presented these technology areas at the 2026 MicroLED Technology Forum in Taipei on 1 September. The forum provided a setting for the company to discuss MicroLED components, mass-production challenges, low-power backplane technology, optical interconnects, CPO, and optical coupling technologies.
The company did not reveal particular products or customers connected with its optical communications activities. Its stated plans centre on applying its silicon backplane and multichannel driving technologies to drive multichannel optical sources and optical interconnects for AI data centres.
