Fraunhofer IPMS Develops Full-Colour RGBW Microdisplays
Scientists at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a full-colour OLED microdisplay based on a 28 nm CMOS process. The technology combines a flexible backplane architecture with RGBW pixels and very small subpixels. The company presented the microdisplay technology at Eurodisplay 2026 in Dublin, Ireland, from 22 to 24 September 2026.
The new generation of microdisplays is designed for near-to-eye visualisation and projection. Intended applications include augmented reality (AR), virtual reality (VR), and mixed reality glasses. The displays are also designed for portable devices and applications that require high image quality from a small-form-factor microdisplay.
The displays are manufactured using a 28 nm CMOS process. Their flexible backplane architecture combines two driving concepts. Frame-based operation supports continuous updates, while memory-based operation supports static content. This allows the display architecture to support different types of visual information without relying on a single driving method.
The displays use full-colour RGBW pixels. An integrated White Calculation Block in the backplane calculates the white subpixel from standard RGB image data. The subpixel measures 2.52 × 2.52 µm². This enables pixel densities of up to 5040 pixels per inch (PPI), providing the high pixel density required for compact microdisplay applications.
The driving architecture also supports different operating requirements. Frame-based operation allows the display to handle continuous updates, including rapid video playback. Memory-based operation is designed for static images and allows the display to operate with lower energy requirements when the displayed content does not need continuous updating.
The technology reduces power consumption while maintaining high resolution. Its driving modes support both rapid video playback and energy-efficient static-image display. These characteristics are intended for battery-powered, lightweight devices where display size and energy consumption are key considerations.
The microdisplays are intended for applications where a small physical display must provide detailed colour images. Their high pixel density and compact subpixel dimensions support near-to-eye visualisation and projection. Stated application areas include AR, VR, and mixed reality glasses, along with portable devices requiring a small form factor.
Fraunhofer IPMS is also developing driving concepts for microdisplays with very high pixel densities. The institute can adapt display parameters and interfaces for specific customer requirements. Its work covers different aspects of microdisplay development and allows display characteristics and interfaces to be adjusted according to individual applications.
The institute also provides support connected with microdisplay development. This includes technology consulting, evaluation kits and pilot production of microdisplays. These activities form part of Fraunhofer IPMS’s work on developing microdisplay technologies and supporting their evaluation and production.
The new RGBW microdisplay therefore combines several technical elements within its backplane architecture. These include the 28 nm CMOS process, frame-based and memory-based driving concepts, an integrated White Calculation Block and RGBW pixels. The 2.52 × 2.52 µm² subpixel size enables pixel densities of up to 5040 PPI.
Fraunhofer IPMS showcased its full-colour RGBW microdisplay technology at Eurodisplay 2026 in Dublin from 22 to 24 September, presenting the technology as part of its work on microdisplays for near-to-eye visualisation and projection.
